20051103 歐盟RoHS指令已確定將十溴聯苯醚(Deca-BDE)列為管制外項目

歐盟RoHS指令已確定將十溴聯苯醚(Deca-BDE)列為管制外項目

經過長時間的議會決策，十溴聯苯醚(Deca-BDE)從RoHS指令中禁用物質的限制中免除，終於有了定案。歐盟委員會已經在2005年10月13日發佈官方公告2005/717/EC。其中很明確的將十溴聯苯醚用於高分子類產品(Deca-BDE in polymeric applications)增列為管制外項目9a. (ANNEX 9a.)；另外，鉛用於鉛銅培林、軸承外殼 (Lead in lead-bronze bearing shell and bushes)也增列為管制外項目9b. (ANNEX 9b.)。所有管制外項目，委員會在西元2010年前依然會持續每四年檢視實際狀況，並在必要時修改更新。此外；歐盟也於2005年10月21日公布另一2005/747/EC指令，增列/修改了2002/95/EC的排外條款，如下所示：

鎘 ( Cadmium )：
電接點(electrical contacts)的鎘及鎘化合物以及91/338/EEC指令限制範圍以外的鎘鍍層中的鎘。
光學玻璃及濾光玻璃(optical and filter glass)中所用的鎘。

鉛 ( Lead )：
高熔點銲錫中的鉛 ( 例如鉛含量 ≧85 % 的合金中的鉛 )。
用於伺服器(servers)、記憶體(storage)和存儲系統(storage array systems)和交換、信號和傳輸，以及電信網路管理的網路基礎設施設備(network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications)中焊料的鉛。
電子陶瓷產品中的鉛。
用於鉛青銅軸承外殼(lead-bronze bearing shells and bushes)的鉛。
光學玻璃及濾光玻璃(optical and filter glass)中所用的鉛。
順應針連接系統(compliant pin connector systems)中使用的鉛
熱導槍釘模組(thermal conduction module c-ring)塗層中所用的鉛。
微處理器針腳及封裝連接所使用含鉛量佔80%-85%的焊接劑(含有超過兩種成份)中的鉛。
用於焊接半導體終端和集成電路板載體的焊料中含鉛量。

十溴聯苯醚 ( Deca-BDE )
應用於高分子類(Polymeric)之十溴聯苯醚之含量。


Deca-BDE is exempted from RoHS Directive

The long struggle on Deca-BDE exemption is finally come to an end. The EU Commission has come to a decision and published the Official Journal 2005/717/EC on 13 Oct 2005, which officially exempted Deca-BDE in polymeric application.
The ground of this Deca-BDE exemption decision is based on the positive risk assessment conclusion, under EEC 793/93 of 23 March 1993, that there is at present no need for measures to reduce the risks for consumer beyond those which are being applied already. Should new evidence lead to a different conclusion of the risk assessment, this decision would be re-examined and amended, if appropriate.
By the same Official Journal 2005/717/EC, “lead in lead-bronze bearing shells and bushes” is also exempted. Like all other exemptions, both of these exemptions will be subjected to a continuation review within a 4 year interval, before 2010.
In addition, the EU Commission published the Official Journal 2005/747/EC which also amended and added exemptions on 21 Oct 2005. Please see list below:

Cadmium:
Cadmium and its compounds in electrical contacts and cadmium plating except for applications banned under Directive 91/338/EEC (*) amending Directive 76/769/EEC (**) relating to restrictions on the marketing and use of certain dangerous substances and preparations.
Cadmium in optical and filter glass.

Lead:
Lead in high melting temperature type solders (i.e. lead-based alloys containing 85 % by weight or more lead)
Lead in solders for servers, storage and storage array systems, network infrastructure equipment for switching, signalling, transmission as well as network management for telecommunications.
Lead in lead-bronze bearing shells and bushes.
Lead used in compliant pin connector systems.
Lead as a coating material for the thermal conduction module c-ring.
Lead in optical and filter glass.
Lead in solders consisting of more than two elements for the connection between the pins and the package of microprocessors with a lead content of more than 80 % and less than 85 % by weight.
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.

Deca-BDE
Deca-BDE in polymeric applications.